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| IR-Lumineszenzdiode (850 nm) mit hoher Ausgangsleistung High Power Infrared Emitter (850 nm) Lead (Pb) Free Product - RoHS Compliant SFH 4250 Vorlaufige Daten / Preliminary Data Wesentliche Merkmale * Infrarot LED mit sehr hoher Ausgangsleistung * Emissionswellenlange typ. 850 nm * Hohe Bestromung bei hohen Temperaturen moglich Anwendungen * Infrarotbeleuchtung fur CMOS Kameras * IR-Datenubertragung * Sensorik Sicherheitshinweise Je nach Betriebsart emittieren diese Bauteile hochkonzentrierte, nicht sichtbare InfrarotStrahlung, die gefahrlich fur das menschliche Auge sein kann. Produkte, die diese Bauteile enthalten, mussen gema den Sicherheitsrichtlinien der IEC-Normen 60825-1 und 62471 behandelt werden. Features * High Power Infrared LED * Peak wavelength typ. 850 nm * High forward current allowed at high temperature Applications * Infrared Illumination for CMOS cameras * IR Data Transmission * Optical sensors Safety Advices Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which can be hazardous to the human eye. Products which incorporate these devices have to follow the safety precautions given in IEC 60825-1 and IEC 62471. Typ Type SFH 4250 1) Bestellnummer Ordering Code Q65110A2465 Strahlstarkegruppierung1) (IF = 100 mA, tp = 20 ms) Radiant Intensity Grouping1) Ie (mW/sr) 10 (typ. 15) gemessen bei einem Raumwinkel = 0.01 sr / measured at a solid angle of = 0.01 sr ATTENTION - Observe Precautions For Handling - Electrostatic Sensitive Device 2007-04-25 1 SFH 4250 Grenzwerte (TA = 25 C) Maximum Ratings Bezeichnung Parameter Betriebs- und Lagertemperatur Operating and storage temperature range Sperrspannung Reverse voltage Vorwartsgleichstrom Forward current Stostrom, tp = 100 s, D = 0 Surge current Verlustleistung Power dissipation Symbol Symbol Wert Value - 40 ... + 100 5 100 1.5 180 300 Einheit Unit C V mA A mW K/W Top , Tstg VR IF IFSM Ptot Warmewiderstand Sperrschicht - Umgebung bei RthJA Montage auf FR4 Platine, Padgroe je 16 mm2 Thermal resistance junction - ambient mounted on PC-board (FR4), padsize 16 mm2 each Warmewiderstand Sperrschicht - Lotstelle bei RthJS Montage auf Metall-Block Thermal resistance junction - soldering point, mounted on metal block Kennwerte (TA = 25 C) Characteristics Bezeichnung Parameter Wellenlange der Strahlung Wavelength at peak emission IF = 100 mA Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 100 mA Abstrahlwinkel Half angle Aktive Chipflache Active chip area Abmessungen der aktiven Chipflache Dimension of the active chip area Symbol Symbol peak 140 K/W Wert Value 850 Einheit Unit nm 35 nm 60 0.09 0.3 x 0.3 Grad deg. mm2 mm A LxB LxW 2007-04-25 2 SFH 4250 Kennwerte (TA = 25 C) Characteristics (cont'd) Bezeichnung Parameter Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, bei IF = 100 mA, RL = 50 Switching times, e from 10% to 90% and from 90% to 10%, IF = 100 mA, RL = 50 Durchlassspannung Forward voltage IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 s Sperrstrom Reverse current VR = 5 V Gesamtstrahlungsfluss Total radiant flux IF = 100 mA, tp = 20 ms Symbol Symbol Wert Value 12 Einheit Unit ns tr , tf VF VF IR 1.5 (< 1.8) 2.4 (< 3.0) V V not designed for A reverse operation 40 mW e typ Temperaturkoeffizient von Ie bzw. e, TCI IF = 100 mA Temperature coefficient of Ie or e, IF = 100 mA Temperaturkoeffizient von VF, IF = 100 mA Temperature coefficient of VF, IF = 100 mA Temperaturkoeffizient von , IF = 100 mA Temperature coefficient of , IF = 100 mA - 0.5 %/K TCV TC - 0.7 + 0.2 mV/K nm/K 2007-04-25 3 SFH 4250 Strahlstarke Ie in Achsrichtung1) gemessen bei einem Raumwinkel = 0.01 sr Radiant Intensity Ie in Axial Direction at a solid angle of = 0.01 sr Bezeichnung Parameter Strahlstarke Radiant intensity IF = 100 mA, tp = 20 ms Strahlstarke Radiant intensity IF = 1 A, tp = 100 s 1) Symbol SFH 4250-R Ie min Ie max Ie typ 10 20 100 Werte Values SFH 4250-S 16 32 140 Einheit Unit mW/sr mW/sr mW/sr Nur eine Gruppe in einer Verpackungseinheit (Streuung kleiner 2:1) / Only one group in one packing unit (variation lower 2:1) Abstrahlcharakteristik Radiation Characteristics Irel = f () 40 30 20 10 0 OHL01660 1.0 50 0.8 0.6 60 0.4 70 0.2 80 90 100 1.0 0.8 0.6 0.4 0 20 40 60 80 100 120 0 2007-04-25 4 SFH 4250 Relative Spectral Emission Irel = f () 100 % OHL01714 Radiant Intensity Ie = f (IF) Ie 100 mA OHL01715 Single pulse, tp = 20 s 10 1 Max. Permissible Forward Current IF = f (TA), RthJA = 300 K/W 120 mA OHL01716 Ie I e (100 mA) I F 100 80 I rel 80 100 5 60 10-1 40 60 5 40 10-2 20 5 20 0 700 750 800 850 nm 950 10-3 0 10 0 5 10 1 5 10 2 mA 10 3 0 20 40 60 80 C 120 IF TA Forward Current IF = f (VF) Single pulse, tp = 20 s Permissible Pulse Handling Capability IF = f (), TA 65 C, duty cycle D = parameter OHL01713 IF 10 A 0 1.6 IF A 1.4 1.2 1.0 0.8 0.6 OHF02505 D = TP t tP IF T 10 -1 5 D= 0.005 0.01 0.02 0.033 0.05 0.1 0.2 0.5 1 10 -2 5 10 -3 5 0.4 0.2 0 0.5 1 1.5 2 2.5 V 3 10 -4 VF 0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102 tp 2007-04-25 5 SFH 4250 Mazeichnung Package Outlines 3.0 (0.118) 2.6 (0.102) 2.3 (0.091) 0.8 (0.031) 0.6 (0.024) 2.1 (0.083) A A 3.7 (0.146) 3.3 (0.130) 41 2.1 (0.083) 1.7 (0.067) 0.9 (0.035) 0.7 (0.028) 0.1 (0.004) (typ.) A A (2.4) (0.095) 3.4 (0.134) 3.0 (0.118) 1.1 (0.043) A C Package marking 0.5 (0.020) 0.6 (0.024) 0.4 (0.016) A C 0.18 (0.007) 0.12 (0.005) GPLY6084 Mae in mm (inch) / Dimensions in mm (inch). Gehause / Package Anschlussbelegung Pin configuration wei, klarer Verguss / white, clear resin Kathode: abgeschragte Ecke Cathode: beveled edge 2007-04-25 6 SFH 4250 Empfohlenes Lotpaddesign Recommended Solder Pad Design Padgeometrie fur verbesserte Warmeableitung Paddesign for improved heat dissipation 2.3 (0.091) 0.8 (0.031) Reflow Loten Reflow Soldering 3.3 (0.130) 3.3 (0.130) 1.1 (0.043) 0.7 (0.028) _ Cu Flache / < 16 mm 2 per pad Cu-area Lotstoplack Solder resist 11.1 (0.437) OHFP3021 3.7 (0.146) Empfohlenes Lotpaddesign Recommended Solder Pad Design 6.1 (0.240) 2.8 (0.110) 2 (0.079) 1.5 (0.059) Wellenloten TTW TTW Soldering 2 (0.079) 3 (0.118) 2 (0.079) 2.8 (0.110) Padgeometrie fur verbesserte Warmeableitung Paddesign for improved heat dissipation 0.5 (0.020) Cu Flache / > 16 mm 2 per pad Cu-area Lotstoplack Solder resist Bewegungsrichtung der Platine PCB-direction OHPY3040 2007-04-25 6 (0.236) 1 (0.039) 7 SFH 4250 Lotbedingungen Soldering Conditions Reflow Lotprofil fur bleifreies Loten Reflow Soldering Profile for lead free soldering 300 C 255 C 240 C 217 C 200 30 s max 150 120 s max 100 Ramp Up 3 K/s (max) 25 C 0 0 50 100 150 200 250 s 300 100 s max Ramp Down 6 K/s (max) 10 s min Vorbehandlung nach JEDEC Level 2 Preconditioning acc. to JEDEC Level 2 (nach J-STD-020C) (acc. to J-STD-020C) OHLA0687 T 250 Maximum Solder Profile Recommended Solder Profile Minimum Solder Profile C 260 C +0C -5 245 C 5 C C 235 C +5C -0 50 t Wellenloten (TTW) TTW Soldering 300 C T 250 235 C ... 260 C 2. Welle 2. wave 200 1. Welle 1. wave 150 100 C ... 130 C 100 2 K/s 50 Zwangskuhlung forced cooling ca 200 K/s 5 K/s 2 K/s (nach CECC 00802) (acc. to CECC 00802) OHLY0598 10 s Normalkurve standard curve Grenzkurven limit curves 0 0 50 100 150 t 200 s 250 2007-04-25 8 SFH 4250 Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com (c) All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2007-04-25 9 |
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